APPLIED JOURNAL OF PHYSICAL SCIENCE
Integrity Research Journals
ISSN: 2756-6684
Model: Open Access/Peer Reviewed
DOI: 10.31248/AJPS
Start Year: 2018
Email: ajps@integrityresjournals.org
Simulation of dielectric properties and thermal conductivity in boron nitride/polyimide composites using the Debye Relaxation Model
https://doi.org/10.31248/AJPS2025.124 | Article Number: BA3567251 | Vol.6 (5) - December 2025
Received Date: 21 May 2025 | Accepted Date: 12 September 2025 | Published Date: 30 December 2025
Authors: Aungwa F.* , Jamila A. B. , Ahuome B. A. and Igba D.S.
Keywords: thermal conductivity, Boron nitride, dielectric, Debye Relaxation Model, polyimide composites
This study investigates the dielectric properties and thermal conductivity of boron nitride/polyimide (BN/PI) composites using the Debye relaxation model. Simulations were conducted using MATLAB to analyse the impact of varying BN content on the dielectric constant, dielectric loss, and thermal conductivity across a range of frequencies and temperatures. The results revealed a strong positive correlation between thermal conductivity and dielectric constant, with a Pearson correlation coefficient of 0.99221 at a frequency of 1 MHz. The thermal conductivity increased from 0.23092 W/m·K at a BN volume fraction of 0.05 to 0.58701 W/m·K at a volume fraction of 0.4, indicating that higher BN content significantly enhances heat dissipation capabilities. The dielectric constant showed a slight but consistent increase, rising from 3.5006 to 3.5046 over the same range. The findings highlight the potential of BN/PI composites for high-performance electronic applications, where efficient thermal management and dielectric stability are essential. These composites, with their exceptional thermal and dielectric properties, are particularly suited for applications in electronic substrates and thermal interface materials, where their tailored balance of properties ensures optimal performance.
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